Heat sink device for cooling chipset

专利摘要:
PURPOSE: A heat sink system is provided to elastically be closely adhered to a chipset by a spring installed at a fixture hole for absorbing a vibration or a shock so that it can prevent a damage of the chipset. CONSTITUTION: The system comprises a heat sink(74) and a fixture device. The heat sink(74) discharges a heat generated at a chipset by being adhered to an upper face of the chipset. The heat sink(74) includes a pair of guide grooves(52) at one end which is not adhered to the chipset. The fixture device, whose rear end is inserted into a hole formed at a circuit board, pushes the heat sink toward the upper face of the chipset. The fixture device includes a plate type rod(56), a fixture pin(66), and a spring(68). The spring(68) winds around a fixing pin(66), and elastically pushes a head(71) of the fixing pin(66) while it is being supported by the plate type rod(56).
公开号:KR20030071118A
申请号:KR1020020010663
申请日:2002-02-27
公开日:2003-09-03
发明作者:이상철
申请人:잘만테크 주식회사；
IPC主号:

专利说明:

Heat sink device for cooling chipset
[21] The present invention relates to a heat sink device, and more particularly, to a chipset cooling heat sink device for cooling a chipset mounted in a circuit between a CPU and a peripheral device.
[22] For example, various components are mounted on a main board in a computer main body. Among the components also include a CPU and a chipset that connects the CPU with peripherals. As known, since the CPU and chipset generate a lot of heat during operation, the heat sink is applied as a separate cooling means.
[23] The heat sink has a heat absorbing part and a heat dissipating part and has a basic function of dissipating heat from the heat generating parts to the outside.
[24] 1 is a perspective view illustrating a conventional chipset cooling heat sink.
[25] As shown, the conventional heat sink 10 is in close contact with the upper surface of the chipset (A) mounted on the circuit board (C), the heat absorbing portion 16 is provided with a mounting hole 14 on the side thereof, Located at the upper end of the heat absorbing portion 16 includes a heat dissipation portion 18 for receiving heat from the heat absorbing portion 16 to be discharged into the air. The heat dissipation unit 18 is composed of a plurality of heat dissipation fins 12.
[26] Reference numeral 24 denotes a mounting hole penetrating the circuit board C. As shown in FIG. The mounting hole 24 is a hole usually formed in the periphery of the chipset (A). Usually, two mounting holes 24 are formed and are positioned at predetermined positions in consideration of compatibility of the circuit board.
[27] The mounting holes 14 extend in opposite directions with the heat absorbing portion 16 of the heat sink 10 interposed therebetween, and vertical bolt holes 20 are formed, respectively. The bolt 22 is fitted into the bolt hole 20. Therefore, after the bolt holes 20 are aligned with the mounting holes 24 and the bolt holes 20 are fitted with the mounting holes 24 with the bolts 22 inserted, the heat sink 10 and the circuit board are coupled. The heat sink 10 is in close contact with the upper surface of the chipset.
[28] However, the conventional heat sink 10 has a problem in that the mounting holes 14 are integrally formed in the heat sink 10 so that the position of the bolt hole 20 cannot be adjusted with respect to the heat sink 10. Therefore, when the bolt hole 20 cannot be matched with the mounting hole 24 formed in the circuit board, there is a problem that the mounting of the heat sink is difficult.
[29] If the bolt holes 20 do not coincide with the mounting holes 24, a new mounting hole corresponding to the bolt holes 20 may be drilled through the circuit board C to allow bolting by installing a heat sink. will be. However, most circuit boards have various components or circuits mounted tightly, so forming a new hole may damage the circuit and cannot be applied in a realistic way.
[30] Therefore, instead of drilling a new mounting hole, an adhesive is used to fix the chipset and the heat sink. In the adhesive method, an adhesive is applied to the top surface of the chipset and the bottom surface of the heat sink, and then pressed to form an adhesive.
[31] However, the adhesive method has a problem that heat transfer may not be effectively performed by the adhesive. The greater the amount of heat transferred from the chipset to the heat sink, the greater the heat dissipation effect, but the adhesive may interfere with heat transfer, making it impossible to effectively cool the chipset.
[32] In addition, since the chipset and heatsink are fully secured by adhesive, it is virtually impossible to separate the heatsink from the chipset if necessary. For example, if the heatsink has a problem and the heatsink is pulled up to separate the heatsink from the chipset, the chipset is torn off from the circuit board, which in turn destroys the chipset itself and the circuit board.
[33] It is very difficult to separate the heatsink from the chipset using any method other than the physical method.
[34] The present invention has been made to solve the above problems, and since the mounting hole provided on the bottom of the heat sink and connecting the heat sink and the circuit board is movable on the bottom of the heat sink, the position of the mounting hole formed around the chipset is Even if it is slightly different, the heat sink can be easily installed by changing the position of the mounting hole. In particular, the spring is applied to the mounting hole so that the heat sink is elastically adhered to the chipset. It is an object of the present invention to provide a heat sink device for cooling a chipset configured to absorb the vibrations or shocks and prevent damage to the chipset.
[1] 1 is a perspective view showing a conventional chipset cooling heat sink.
[2] Figure 2 is a perspective view showing a partially exploded chipset cooling heat sink device according to an embodiment of the present invention.
[3] 3 is a view illustrating a coupling mechanism of a mounting hole for a heat sink in a chipset cooling heat sink device according to an embodiment of the present invention.
[4] Figure 4 is an inverted perspective view of a chipset cooling heat sink device according to an embodiment of the present invention.
[5] 5 is a diagram illustrating a state in which a chipset cooling heat sink device is installed on a circuit board according to an exemplary embodiment of the present invention.
[6] 6 is a diagram illustrating a state in which a chipset cooling heat sink device according to an embodiment of the present invention is installed on a circuit board.
[7] <Explanation of symbols for the main parts of the drawings>
[8] 10: heat sink 12: heat dissipation fin
[9] 14, 54: Mounting part 16: Heat absorption part
[10] 18: heat dissipation part 20: bolt hole
[11] 22: Bolt 50: Heat Sang device
[12] 52: guide groove 56: plate-shaped rod
[13] 58: Long 60: Bolt
[14] 62: nut 64: through hole
[15] 66: retaining pin 68: spring
[16] 70: support jaw 71: head
[17] 72: contact surface 74: heat sink
[18] 76: mounting hole 78: locking jaw
[19] 80: space part 82: bottom
[20] A: Chipset C: Circuit Board
[35] In order to achieve the above object, the present invention is responsible for the relay between the CPU mounted on the circuit board and the peripheral device, the cooling of the chipset is formed around the plurality of mounting holes, close contact with the upper surface of the chipset Heat sinks that emit heat generated from the chipset to the outside but are not in close contact with the chipset on the bottom thereof, and a pair of guide grooves parallel to each other are formed; And a mounting means for supporting the heat sink in close contact with the upper end of the chipset by supporting the mounting hole of the circuit board while the rear end is fixedly movable in the guide groove.
[36] In addition, the mounting means; The plate-shaped rod having a predetermined width and length and vertically penetrating long holes is inserted in the longitudinal direction, and is inserted into the long hole of the plate-shaped rod, and at the bottom thereof, the circuit board can be supported upward through the mounting holes of the circuit board. A fixing jaw having a locking jaw formed thereon and a head provided at an upper end thereof, a spring surrounding the fixing pin and a spring supporting the head upwardly while the lower end is supported by the plate-shaped rod, and a rear end of the plate-shaped rod guide groove. It characterized in that it comprises a fixing means for fixing to position at a desired position.
[37] In addition, the fixing means; A bolt passing the plate-shaped rod from the bottom to the top thereof, and a nut coupled to the bolt but not completely coupled to the bolt, the nut being spaced apart from the head of the bolt; It accommodates the nut in the state coupled with the bolt, but has a space portion having a locking jaw for supporting the nut to the upper portion, the bolt head to the upper plate plate rod by rotating and tightening the bolt with respect to the nut supported on the locking jaw It is characterized in that the support of the plate-like rod to the heat sink to form a pressure support.
[38] In addition, the guide groove has the same cross-sectional shape in the longitudinal direction and is characterized in that both ends are open to both side walls of the heat sink.
[39] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[40] 2 is a perspective view illustrating a partially disassembled heat sink for cooling a chipset according to an exemplary embodiment of the present invention.
[41] Referring to the drawings, the chipset cooling heat sink device 50 according to the present embodiment, the heat sink is mounted on the top surface of the chipset (A of FIG. 5) and two guide grooves 52 are formed on the bottom surface thereof. 74 and a mounting hole 54 coupled to the circuit board (C of FIG. 5) in a state of being fitted into the guide groove 52 of the heat sink 74.
[42] Like the known heat sink, the heat sink 74 has a plurality of heat sink fins 12 and dissipates heat of the chipset into the air. The center portion of the bottom surface of the heat sink 74 may be flatly processed as shown in FIG. 4 to be completely in contact with the top surface of the chipset.
[43] The guide grooves 52 are formed at both sides of the bottom surface of the heat sink 74. The guide grooves 52 are parallel to each other and are symmetrical with the chipset A therebetween as shown in FIG. 6. In addition, the same cross-sectional shape in the longitudinal direction of the groove is not narrowed or widened, and both ends thereof are open to both side walls of the heat sink 74.
[44] The mounting holes 54 include a plate-shaped rod 56 having a long hole 58 and a through hole 64 formed therein, a fixing pin 66 fitted into the long hole 58 of the plate-shaped rod 56. It includes a spring 68 for elastically supporting the fixing pin 66 to the upper hole 58, the bolt 60 and the nut 62 are coupled to each other through the through hole 64. The plate-shaped rod 56 is a strip-shaped member having a predetermined width and thickness and extending in the longitudinal direction.
[45] The through hole 64 is a hole formed at the rear end of the plate-shaped rod 56, and the bolt 60 fitted into the through-hole 64 serves as a rotation shaft of the plate-shaped rod 56 as described later. . The bolt 60 passes through the through hole 64 from the bottom up and engages with the nut 62. At this time, the nut 62 is spaced apart from the bolt head without being completely engaged with the bolt 60 and is located in the space portion 80 of the guide groove 52.
[46] Of course, the nut 62 is linearly movable along the longitudinal direction of the guide groove 52 in a state where the nut 62 is located in the space 80. In addition, since the nut 62 is coupled to the bolt 60 in a state where the nut 62 is located in the space 80, the plate-shaped rod 56 is supported upward by the head of the bolt 60. This means that when the bolt 60 is pushed against the nut 62, the plate-like rod 56 can be fixed to the heat sink 74.
[47] The fixing pin 66 installed in the long hole 58 is a known one, and the head 71 is formed at the upper end thereof, and the support jaw 70 is formed at the lower end thereof. The portion corresponding to the lower portion of the support jaw 70 has a diameter larger than the diameter of the other place, and the lower end thereof is cut off and retracts when passing through the hole and opens again after passing through the hole. Therefore, as shown in FIG. 6, the fixing pin 66 may be inserted into a mounting hole (24 of FIG. 5) formed in the circuit board C to connect the plate rod 56 and the circuit board.
[48] The spring 68 elastically supports the fixing pin 66 upward with respect to the plate-shaped rod 56. The spring 68 surrounds the fixing pin 66 and presses the head 71 upward while the lower end thereof is supported by the plate-shaped rod 56. Even if the fixing pin 66 is elastically supported upward, the supporting jaw 70 is caught by the edge of the long hole 58 so that the fixing pin 66 is not separated from the long hole 58.
[49] As a result, the mounting holes 54 can be linearly moved in the direction of arrow a along the guide grooves 52 in the assembled state, and can be rotated in the direction of arrow b using the bolt 60 as the rotation shaft. Therefore, even if the position of the hole formed around the chipset is different for each circuit board, by changing the position of the mounting holes 54 can be mounted as much as possible, the compatibility can be expected as much.
[50] 3 is a view illustrating a coupling mechanism of a mounting hole for a heat sink in a chipset cooling heat sink device according to an embodiment of the present invention.
[51] Referring to the drawings, the space portion 80 is formed in the guide groove 52. The space portion 80 is a space for accommodating the nut 62, and a locking jaw 78 is formed so that the nut 62 does not fall downward.
[52] The bolt 60 is coupled to the nut 62 in a state where the plate-shaped rod 56 penetrates from below. The nut 62 is not fully engaged with the bolt 60 and is spaced apart from the bolt head and the plate-shaped rod 56. In this state, when the bolt 60 is rotated with respect to the nut 62 in the tightening direction, the nut 62 is supported by the latching jaw 78, so that the nut 62 and the plate-shaped rod 56 are pressurized in a direction close to each other. do. That is, the plate-shaped rod 56 is strongly pressed and fixed to the bottom surface 82 of the heat sink 74.
[53] Even if the bolt 60 is tightened, the nut 62 is initially supported by the locking jaw 78 so that the nut 62 does not rotate in the space 80. However, even if the bolt 60 is turned with a strong force, the width w of the space portion 80 may be formed to correspond to the minimum outer diameter of the nut so that the nut 62 does not rotate.
[54] In addition, the fixing pin 66 which is vertically positioned inside the long hole 58 is elastically supported upward by a spring 68. In FIG. 3, although the fixing pin 66 is pushed outward of the long hole 58, the fixing pin 66 may be moved in the direction of the arrow c as necessary.
[55] 4 is an inverted perspective view of a chipset cooling heat sink device according to an embodiment of the present invention.
[56] As shown, the rear end of the plate-shaped rod 56 is supported by the bolt 60. As described above, the bolt 60 can be linearly moved along the longitudinal direction of the guide groove 52, and the plate rod 56 can also rotate the bolt 60 in the rotational axis, thereby providing a circuit board (C of FIG. 5). Even if the position of the mounting hole (24 in FIG. 5) slightly differs, the position of the fixing pin 66 can be adjusted so that the fixing pin can be positioned on the vertical portion of the mounting hole.
[57] In addition, the contact surface 72 in contact with the chipset on the bottom surface of the heat sink 74 is processed flat.
[58] 5 is a diagram illustrating a state in which a chipset cooling heat sink device is installed on a circuit board according to an exemplary embodiment of the present invention.
[59] As shown, two mounting holes 24 are formed around the chipset A. The mounting holes 24 pass through the circuit board C as holes through which the fixing pin 66 is to be inserted. It is formed.
[60] In addition, in this embodiment, since the two mounting holes 24 are located in the diagonal direction of the chipset A, the plate-shaped rods 56 on both sides are fixed in the diagonal direction at the bottom of the heat sink 74, The fixing pin 66 was positioned in the vertical portion of the mounting hole 24. In this state, the heat sink 74 is placed on the upper surface of the chipset A, and the fixing pin 66 is inserted into each of the mounting holes 24. As shown in FIG. 6, the heat sink with respect to the circuit board C is shown. 74 is mounted. At this time, the top surface of the chipset (A) and the bottom surface of the heat sink 74 is of course elastically in close contact.
[61] 6 is a diagram illustrating a state in which a chipset cooling heat sink device according to an embodiment of the present invention is installed on a circuit board.
[62] Referring to the drawings, it can be seen that the plate-shaped rods 56 on both sides are tightly and horizontally fixed to the bottom surface of the heat sink 74. This is the result of tightening bolt 60 against nut 62. In addition, the fixing pin 66 is inserted into the long hole of the plate-shaped rod 56, the lower end portion thereof passes through the circuit board (C). As described above, since the fixing pin 66 is elastically supported upward by the spring 68, the support jaw 70 positioned below the circuit board C elastically supports the circuit board C upward. That is, the heat sink 74 is elastically in close contact with the chipset A. FIG.
[63] Since the heat sink 74 is elastically in close contact with the chipset A as described above, vibrations or shocks from the outside are absorbed by the springs and thus do not affect the chipset.
[64] As mentioned above, although this invention was demonstrated in detail through the specific Example, this invention is not limited to the said Example, A various deformation | transformation is possible for a person with ordinary knowledge within the scope of the technical idea of this invention.
[65] In the chipset cooling heat sink device of the present invention as described above, the mounting holes provided on the bottom surface of the heat sink and connecting the heat sink and the circuit board are movable on the bottom surface of the heat sink. Even if the position of the heat sink is slightly different, the heat sink can be easily installed by changing the position of the mounting hole. In particular, by applying a spring to the mounting hole so that the heat sink is elastically close to the chipset, even if vibration or shock is applied from the outside, the spring absorbs vibration or shock, thereby preventing damage to the chipset.

权利要求:
Claims (4)
[1" claim-type="Currently amended] It is responsible for relaying between the CPU and peripheral devices mounted on the circuit board, and cooling the chipset A having a plurality of mounting holes formed therein.
A heat sink 74 having a pair of guide grooves 52 parallel to each other in contact with the top surface of the chipset to emit heat generated from the chipset to the outside but not in close contact with the chipset on the bottom; ;
And a mounting means supported by the mounting hole 24 of the circuit board C in a state where a rear end thereof is fixedly movable in the guide groove 52 to fix the heat sink 74 to the upper portion of the chipset. Chipset cooling heat sink device.
[2" claim-type="Currently amended] The method of claim 1,
The mounting means;
A plate-shaped rod 56 having a predetermined width and length, and having a long hole 58 vertically penetrating therein,
It is inserted into the long hole 58 of the plate-shaped rod 56, the lower end of the support jaw 70 is formed to pass through the mounting hole 24 of the circuit board to support the circuit board to the top and the head ( 71 is provided with a fixing pin (66),
A spring 68 which wraps around the fixing pin 66 and elastically supports the head 71 to the upper side while being supported by the plate-shaped rod 56;
Chipset cooling heat sink device characterized in that it comprises a fixing means for fixing by positioning the rear end of the plate-like rod 56 in a desired position of the guide groove (52).
[3" claim-type="Currently amended] The method of claim 2,
The fixing means; Bolts 60 passing through the plate-shaped rod 56 from the bottom to the top,
A nut 62 coupled to the bolt 60 but not fully coupled to be spaced apart from the head of the bolt,
The guide groove 52 is; It has a space portion 80 having a locking jaw 78 for accommodating the nut 62 in a state coupled with the bolt 60 therein, and supports the nut 62 to the upper portion, the locking jaw 78 By rotating and fastening the bolt 60 with respect to the supported nut 62, the bolt head presses and supports the plate-shaped rod 56 upward to form a coupling of the plate-shaped rod 56 to the heat sink 74. Chipset cooling heat sink device.
[4" claim-type="Currently amended] The method according to any one of claims 1 to 3,
The guide groove 52 has the same cross-sectional shape in the longitudinal direction and both ends are open to both side walls of the heat sink, chipset cooling heat sink device.

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同族专利:

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公开号 | 公开日

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KR100457220B1|2004-11-16|

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US20030159819A1|2003-08-28|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2002-02-27|Application filed by 잘만테크 주식회사

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2002-02-27|Priority to KR20020010663A

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2003-09-03|Publication of KR20030071118A

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2004-11-16|Application granted

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2004-11-16|Publication of KR100457220B1

优先权:

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申请号 | 申请日 | 专利标题

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KR20020010663A|KR100457220B1|2002-02-27|2002-02-27|Heat sink device for cooling chipset|